rbtfl.

supply-chain market intelligence

By lens · 2 takes across the edition

Reads SiC/GaN as the answer to the AI 'power wall' in the HVDC era, at 800V the efficiency gains of wide-bandgap devices outweigh their cost premium over silicon, with architectures cutting data-centre energy use by up to 7%, reshaping demand for SiC wafers and GaN devices.

“At 800V, wide-bandgap efficiency gains outweigh the cost premium over silicon; HVDC architectures can cut data-centre energy use up to 7%.”

Details the glass-substrate supply chain, Intel's EMIB-plus-glass samples, Samsung's SEMCO line, and SK Absolics shipping first commercial-grade glass from Covington, Georgia to AMD and Amazon, quantifying 50% lower transmission power and 40% better signal integrity versus organic substrates.

“Glass offers 50% lower signal-transmission power and 40% better signal integrity than organic; Absolics ships first commercial panels from Georgia to AMD and Amazon.”