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MIT Technology Review · United States · Glass substrates break through as AI packaging hits an organic wall
Explains why AI chips are moving to glass cores: organic resin substrates are warping and cracking under ever-larger multi-die packages, while glass offers flatness, dimensional stability and finer interconnect, the material precondition for next-generation HBM-heavy AI accelerators.
“Organic resin substrates warp under ever-larger AI packages; glass offers the flatness and dimensional stability next-generation multi-die accelerators need.”