Samsung

韩国两大芯片制造商正准备该国史上规模最大的国内合并投资承诺，预计于6月30日在青瓦台举行简报

6月26日三星和SK海力士下跌8-9%，韩国基准指数跌5.81%，交易暂停20分钟。同一芯片数据推动东京日经指数上涨4.6%

美光科技破纪录季报确认HBM主导地位，SK海力士涨13%、三星涨5%；韩国指数创历史新高，日本指数首次突破7万点

Beijing investigates memory pricing, fines could reach $2.5B, while domestic champion CXMT files for a $4.2B IPO and nears third-largest by wafer capacity

Seoul bilateral yields HBM4E samples and LP40 foundry talks; Tesla A16 to be built at Taylor, Texas; Samsung pins HBM5 comeback on an in-house 2nm base die

Jensen Huang confirms Samsung, SK Hynix and Micron passed HBM4 qual on June 5; SK Hynix holds ~60-70% of Rubin volume, 12-layer stacks priced above $600

Intel and Samsung start the shift from organic resin to glass cores; SK's Absolics ships first commercial-grade panels; Korea contests Intel on standards